Via Experience Mobility (and in turn via OnTheRun)

Major size reductions for UMPCs will be possible with the new Via VX700 chipset – cutting down the thickness and overall size of these devices dramatically. 

This is a very cool video demonstration from an MS Mobile Platform Manager – giving some background on the Origami / UMPC project, and a great glimpse of what is going to be possible in size reductions for UMPC devices.

Check out how much smaller the motherboards will be when using the new VIA VX700 chipset, mentioned in a recent post here.

Thanks to Jack at Experience Mobility for spreading the word on this clip. Go see it at:

UMPC Background & VX700 Preview

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